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BackCL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip SMD 2x28 1.00mm double row Through hole angled pin header SMD 1x20 1.27mm single row Through hole socket strip THT 1x03 2.54mm single row Through hole socket strip SMD 1x12 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x40 2.00mm double row Through hole socket strip SMD 1x14 2.00mm single row Surface mounted pin header THT 1x04 5.08mm single row Through.
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