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Sot556-1_po.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (2mm x 2mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105310-xx04, 2 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 48 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, MultiwattF-11, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 2.286mm SIPAK Vertical RM 5.08mm TO-126-3, Horizontal, RM 2.54mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-4 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-4, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP Switch SPST Slide 7.62mm 300mil 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62.

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