Labels Milestones
BackSTLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated.
- S2B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator.
- Pad as test Point, diameter.