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Module Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 900 1.

• C/2, Vertical, 3 rows 32 pins.
• 9.041077e-001 facet normal 2.588559e-001 1.152516e-003 9.659153e-001.

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