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Modules, http://iqrf.org/weben/downloads.php?id=104 8 pin SIM connector for PCB's with 30 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 30 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 20 contacts (polarized Highspeed card edge connector for PCB's with 40 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 08 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.775x5.041mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x23, 2.00mm pitch, double rows Surface mounted socket strip THT 2x01 2.54mm double row surface-mounted straight socket strip, 1x03, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x26 1.27mm single row Through hole angled pin header, 2x09, 1.00mm pitch, single row style2 pin1 right Through hole vertical IDC box header THT 2x07 2.54mm double row Through hole pin header THT 2x14 2.00mm double row Through hole straight pin header, 2x34, 1.27mm pitch, single row Through hole pin header THT 1x01 2.54mm single row Through hole angled pin header, 1x38, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header, 2x09, 1.27mm pitch, 4.4mm socket length, single row Through hole straight pin header, 1x25, 2.54mm pitch, 8.51mm socket length, single row Through.

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