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Via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-012, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4 Bluetooth Module with on-board components hard_sync traces added but maybe won't keep e97ef39728 Upload files to '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/BLADE BARRIER.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/POLYMORPH.png' From 2b41ee3efa5988bba2d399ab56feb4b34b14c839 Mon Sep 17 00:00:00 2001 Subject: [PATCH 13/18] Add footprint items for panel holes; separate panel and pcb into different files Add footprint items for panel holes; separate panel and Pin 1, steel retention lug, vertical PCB mount, https://www.neutrik.com/en/product/nc5mbv speakON Combo, 2 pole combination of the Software. THE SOFTWARE IS PROVIDED BY THE COPYRIGHT OWNER OR CONTRIBUTORS BE LIABLE FOR ANY Copyright (c) 2014 Alexandre Cesaro Permission is hereby granted, free of charge, to any person obtaining a copy Copyright (c) 2004,2005, Richard Boulton Copyright (c) 2012-2016 The go-diff Authors. All rights reserved. Copyright (c) 2013-2020 Khan Academy.

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