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High-Density Packaging Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.

• 6.861797e-01 vertex -1.087443e+02 9.695134e+01.
• 1.108280e-13 -1.000000e+00 2.993235e-13 vertex.

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