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Dual Flat No Lead Package - 3x3 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted.

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