Labels Milestones
BackCPG238 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf.
- 5.15907 -1.48976 19.1916 facet normal 0.0754488.
- -5.348437e+000 4.564150e+000 9.983999e+000 vertex 4.028628e+000 -4.029531e+000 1.747200e+001.
- Revised README.md to rev 2 's.
- Copper, 4.5mm soldermask opening Circular.
- Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA.