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Smt echo("knurled cylinder min diameter: ", 2*cord); echo("knurled cylinder max diameter: ", 2*cord); echo("knurled cylinder min diameter: ", 2*cord); echo("knurled cylinder max diameter: ", 2*cird); if( fsh < 0 shape(fsh, cird+cdp*smt/100, cord, cfn*4, chg); module shape(hsh, ird, ord, fn4, hg) { x0= 0; x1 = hsh > 0 ? Ord : ird; y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( hsh >= 0 } module make_surface(filename, h) { wants to merge 5 commits from pcb_finalization into main v1 Final tweaks, version submitted to JLCPCB on 20240124 63579cf959 Add notes about UX component wiring 9f9f6acf76f746b4755da71c07bb656091774052 SMT updates 289eacd41f936a34813e1e82f711b9b6ca96fb7b Checkpoint after converting most things to SMD Latest commits for file Docs/use.md main synth_tools/Schematics/SynthMages.pretty/Pushbutton Switch (PBS105).kicad_mod 32 lines main synth_tools/Schematics/SynthMages.pretty/POT_2_PIN_Header.kicad_mod 44 lines main synth_tools/Panels/Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for a drone / manual version, https://kassu2000.blogspot.com/2018/07/avalance-vco.html for a single 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xx-DV-TE, 27 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package - 4.0x4.0x0.8 mm Body [QFN]; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.65mm.

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