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Package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13.

• 13962 bytes From b2f0340111348a8deafde0ffe244939fe4eeb6b7 Mon Sep 17 00:00:00.
• 0.991524 -0.109217 0.0703647 facet normal 1.240490e-15 9.755479e-16.
• Normal 0.46415 -0.23112 0.855072 vertex 4.78839.
• Vertex 5.0656 -0.339142 18.8084.

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