Labels Milestones
BackD2PAK / DDPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package Diotec Diotec MicroDil, body 3.0x3.0x1.8mm (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge Vishay KBU rectifier package, 5.08mm pitch, single row style2 pin1 right Through hole socket strip SMD 2x23 2.00mm double row SMD IDC box header THT 2x04 2.00mm double row Through hole socket strip SMD 1x18 1.00mm single row style1 pin1 left Surface mounted socket strip THT 1x29 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x36 1.27mm double row Through hole straight pin header, 2x22, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole Samtec HPM power header series 3.81mm post length THT 1x14 2.00mm single row Surface mounted pin header SMD 1x36 2.54mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x09 1.00mm double row Through hole pin header THT 1x38 2.00mm single row Through hole angled socket strip, 2x09, 1.00mm pitch, single row Through hole angled socket strip, 2x17, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x12, 5.08mm pitch, single row Surface mounted socket strip THT 1x18 2.54mm single row Surface mounted socket strip THT 1x13 1.27mm single row Through hole straight socket strip, 1x04, 2.00mm pitch, double rows Through hole straight pin header, 1x11, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight socket strip, 2x16, 2.00mm pitch, 4.2mm pin length, single row male, vertical entry, no latches, PN:G125-MVX0605L0X Harwin Gecko Connector, 16 pins, pitch 7.5mm, size 44x15mm^2, drill diamater 1.3mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Broadcom LGA, 8 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-02P-1.25DS, 2 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wire, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam.
- * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf.
- Spring contact emi emc shield Tag-Connect.