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B3SL Middle Stroke Tactile Switch, B3SL Middle Stroke Tactile Switch, B3SL Middle Stroke Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch for High-Density Mounting, 7.3mm height, https://omronfs.omron.com/en_US/ecb/products/pdf/en-b3fs.pdf Surface Mount Tactile Switch for High-Density Packaging with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, with Boss SPST button tactile switch SPST right angle, http://spec_sheets.e-switch.com/specs/P040170.pdf Switch, single pole normally-open illuminated tactile switch with ground pin http://www.ckswitches.com/media/1479/kmr2.pdf tactile push button, 6x6mm e.g. PHAP33xx series, height=8.5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=13mm FS5700 series pushbutton footswitch, DPDT, https://www.e-switch.com/system/asset/product_line/data_sheet/226/FS5700.pdf Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 7.62mm 300mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 11.48 mm (451 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 8.61 mm (338 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (4mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://www.akm.com/akm/en/file/datasheet/CQ-330J.pdf AKM CZ-381x current sensor, 5.6x7.9mm body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole angled socket.

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