Labels Milestones
Back1.854mm thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 6.1 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 44 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN.
- Stem. In OpenSCAD, polygons ("cylinders") are created.
- Hand-soldering, 1.6x1.0mm^2 package SMD Crystal Oscillator Seiko.