synth_tools

Back

0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 2 pads, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PTSM-0,5-2-2.5-V-THR vertical pitch 5mm size 32.3x14mm^2 drill 1.15mm pad 3mm REDCUBE THR with internal through-hole thread WP-THRBU (https://www.we-online.de/katalog/datasheet/74650173.pdf REDCUBE THR with internal through-hole thread WP-THRBU (https://www.we-online.de/katalog/datasheet/74650173.pdf REDCUBE THR with internal through-hole thread WP-THRSH (https://www.we-online.de/katalog/datasheet/74651195.pdf Test point with 2 copper strips SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x20 1.27mm single row style2 pin1 right Through hole angled pin header THT 2x17 1.27mm double row surface-mounted straight socket strip, 2x09, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x04 2.54mm single row male, vertical entry, no latches, PN:G125-MVX1605L0X Harwin Gecko Connector, 34 pins, single row style1 pin1 left Surface mounted socket strip SMD 1x07 2.54mm single row Through hole straight pin header, 1x01, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x09 1.00mm single row Through hole angled socket strip THT 1x01 1.00mm single row Surface mounted pin header THT 1x26 2.00mm single row Through hole socket strip SMD 1x14 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 2x03 2.00mm double row Through hole.

New Pull Request

Labels Milestones