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Flatpack (MW) - 10x10x1.0 mm Body with Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0430, 4 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST XA series connector, 202396-0207 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator JST PH series connector, S14B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 10.6, Wuerth electronics 9774040360 (https://katalog.we-online.de/em/datasheet/9774040360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1330, 13 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Hirose FH41, FFC/FPC connector, FH12-35S-0.5SH, 35 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wire, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.5mm, size 21x6.5mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 2mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times.

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