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Safety block and into any non-high-impedence connections; that is, fat traces to chip power, but not to front panel Added schmancy pcb for v1 front panel components version Latest commits for file Schematics/OttosIrresistableDance/OttosIrresistableDance.kicad_pcb b0f8ee4ade Go to file 45c41b9873 More mounting hole 5.3mm m5 iso14580 Mounting Hole 2.7mm, no annular, M2 mounting hole 5.3mm no annular m4 iso14580 Mounting Hole 5.3mm, no annular, M6, ISO14580 mounting hole 3.2mm no annular m2 Mounting Hole 2.2mm, no annular, M2.5 mounting hole 4.3mm m4 iso7380 Mounting Hole 4.3mm, no annular, M2.5, ISO14580 mounting hole 5.5mm no annular Mounting Hole 3.2mm, no annular, M2, DIN965 mounting hole 5.3mm no annular Mounting Hole 5.3mm, no annular, M3, ISO14580 mounting hole 6.4mm m6 Mounting Hole 3.2mm, no annular, M2.5 mounting hole 3.2mm no annular Mounting Hole 6.4mm, no annular, M5, DIN965 mounting hole 2.7mm m2.5 iso14580 Mounting Hole 3.2mm, M3, ISO14580 mounting hole 6mm no annular Mounting Hole 3.2mm, no annular, M5, ISO14580 mounting hole 2.7mm no annular Mounting Hole 4.3mm, M4, DIN965 mounting hole 8.4mm no annular mounting hole 4.3mm no annular m8 Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://www.mspindy.com/specifications/AST1109MLTRQ.pdf Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils SMD DIP Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET M4 MOSFET Infineon.

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