3
1
Back

(http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0810, with PCB cutout, light-direction downwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for diode bridges, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 5x-dip-switch SPST KingTek_DSHP05TJ, Slide, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 7.62 mm.

New Pull Request