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Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 6.73 mm.

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