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Die Pad (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam.

(end 164 122 (end 165.015 122.
Series layout), mates with Phoenix MSTB2,5/3-ST, horizontal.
As 2v could works.
Push, https://www.neutrik.com/en/product/nc3fav2-da A Series, 3 pole male.

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