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8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x27, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 1x30, 1.27mm pitch, single row Through hole angled pin header, 2x09, 2.54mm pitch, double rows Surface mounted pin header THT 1x10 1.27mm single row male, vertical entry, no latches, PN:G125-MVX3405L0X Harwin Gecko Connector, 16 pins, pitch 10mm, size 75x8.1mm^2, drill diamater 1.3mm, pad diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890.

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