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Number: 1830693 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/8-G-3.5; number of pins: 07; pin pitch: 7.62mm; Vertical; threaded flange || order number: 1776002 12A Generic Phoenix Contact connector footprint for: MC_1,5/8-GF-3.5; number of pins: 11; pin pitch: 5.08mm; Vertical || order number: 1924596 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/3-GF-5.08; number of pins: 02; pin pitch: 5.08mm; Vertical || order number: 1830664 8A 160V Generic Phoenix Contact SPT 5/3-H-7.5-ZB 1719202 Connector Phoenix Contact connector footprint for: MSTBV_2,5/12-GF-5,08; number of pins: 10; pin pitch: 5.08mm; Angled || order number: 1776951 12A || order number: 1776524 12A || order number: 1777219 12A Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/2-G-7,62; number of pins: 12; pin pitch: 3.50mm; Angled; threaded flange || order number: 1766372 12A 630V Generic Phoenix Contact SPT 5/5-V-7.5-ZB 1719341 Connector Phoenix Contact, SPT 5/3-H-7.5 Terminal Block, 1990821 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990821), generated with kicad-footprint-generator connector Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-02A1, example for new mpn: 39-30-0120, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-05A, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Inductor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Quad Flat No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 32 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 48 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout.

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