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300mil 8-lead dip package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body.

• 0.403621 -0.491817 0.771496 vertex 7.11876 4.7566.
• -0.0818897 0.993256 facet normal -0.468298 0.312748 -0.826369 vertex.

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