3
1
Back

10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78Bxx-2.0.pdf dc-dc recom buck sip-3 pitch 2.54mm size 13.2x6.2mm^2 drill 1.1mm pad 2.1mm Terminal Block Phoenix MKDS-1,5-12, 12 pins, pitch 5mm, size 20x12.6mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00306.

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