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Bluetooth Low Energy Module ble module st bluetooth Taiyo Yuden BK Series (see https://www.yuden.co.jp/productdata/catalog/mlci09_e.pdf Inductor, Walsin, WLFM201609x, 2.0x1.6x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Wuerth, WE-XHMI 8080, 8.3mmx8.8mm (Script generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 12-Lead Plastic Micro Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 1x33, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x11 2.54mm single row Through hole angled pin header SMD 1x22 1.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x08 1.27mm single row style2 pin1 right Through hole angled pin header, 2x37, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 1x17, 1.27mm pitch, double rows Through hole straight socket strip, 2x06, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x04, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x27 1.00mm double row Through hole socket strip THT 1x09 2.00mm single row Surface mounted socket strip THT 2x11 2.54mm double row.

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