Labels Milestones
BackDFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small.
- 0.469189 0.877691 0.0975691 vertex 3.44415 -8.31492.
- 171.39 121.975 (end 171.953606 129.605 (end 170.373606 128.025.