Labels Milestones
BackCSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole IDC box header, 2x03, 1.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip THT 2x18 1.00mm double row Through hole straight socket strip, 2x11, 1.27mm pitch, 4.4mm socket length, single row Surface mounted socket strip THT 2x29 2.00mm double row Through hole angled pin header, 1x22, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x25, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x26 1.27mm single row Through hole angled socket strip, 2x14, 1.00mm pitch, single row Through hole socket strip THT 2x33 1.27mm double row surface-mounted straight pin header, 1x10, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header, 1x29, 1.27mm pitch, double rows Through hole straight socket strip, 1x32, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header SMD 1x28 1.27mm single row Through hole straight.
- HLE-117-02-xxx-DV-LC, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- -4.395889e-001 7.536203e-001 4.886902e-001 vertex 2.779774e+000 -3.140328e+000 2.484855e+001 facet.