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Grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip THT 1x35 2.54mm single row Surface mounted socket strip THT 1x30 1.27mm single row Through hole straight pin header, 2x32, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header THT 2x22 1.27mm double row surface-mounted straight pin header, 2x27, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled pin header, 2x07, 2.00mm pitch, 6.35mm socket length, single row Surface mounted pin header THT 1x03 2.00mm single row style2 pin1 right Through hole horizontal IDC box header, 2x06, 1.00mm pitch, double rows Through hole socket strip THT 2x02 2.00mm double row surface-mounted straight socket strip, 2x28, 1.27mm pitch, double rows Surface mounted pin header SMD 2x30 2.00mm double row Through hole.

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