Labels Milestones
BackRM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 5.45mm TO-3P-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-4 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 1.27mm staggered type-2 TO-220F-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-5, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-4, Vertical, RM 1.27mm, staggered type-2 TO-220F-15 Vertical RM 10.9mm TO-247-3, Horizontal, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-15, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-9, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 7.62mm 300mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size.
- 0.678283 0.205751 0.705407 vertex 3.43962 9.09213 3.26879.
- Nexperia wafer level chip-size package; 15.