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BackSee figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [TSSOP] with exposed pad Micrel MLF, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0220, 22 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 10, Wuerth electronics 9774035943 (https://katalog.we-online.de/em/datasheet/9774035943.pdf), generated with kicad-footprint-generator connector wire 0.15sqmm strain-relief Soldered wire connection, for 5 times 1.5 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Dual Flat No Lead Package - 4x4x0.9 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20.
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