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RND 205-00046, 3 pins, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf dc-dc recom buck sip-4 pitch 2.54mm DCDC-Converter, RECOM, RECOM_R-78HB-0.5, SIP-3, pitch 2.54mm, package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf RPA60-FW 60W Isolated DC to 11GHz Molex MMCX Horizontal Coaxial Molex MMCX Horizontal Coaxial Molex MMCX Horizontal Coaxial Molex MMCX Coaxial Connector 50 ohms Female Würth WR-MMCX PCB SMT Jack, Horizontal (https://www.we-online.com/components/products/datasheet/66011102111302.pdf Jushuo AFC07, FFC/FPC connector, AFC07-S06FCA-00, 6 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DHVQFN, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf), generated with kicad-footprint-generator JST ZE series connector, 53261-1271 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad HTSSOP32: plastic thin shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Small Outline (ST)-4.4 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile.

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