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Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.65mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x15, 2.00mm pitch, 6.35mm socket length, single row style1 pin1 left Surface mounted socket strip THT 1x03 2.00mm single row Through hole IDC header, 2x17, 2.54mm pitch, 8.51mm socket length, double rows Through hole socket strip SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip SMD 1x34 2.00mm single row Through hole angled pin header THT 2x40 2.54mm double row Through hole straight socket strip, 2x13, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled socket strip THT 2x16 1.00mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x01 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x10 1.00mm double row surface-mounted straight pin header, 2x40, 1.00mm pitch, double rows Surface mounted socket strip THT.

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