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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole socket strip SMD 2x11 2.00mm double row Through hole socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 2 copper strips SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, bridged with 1 copper strip SMD 2x13 2.00mm double row Through hole angled pin header THT 2x15 2.54mm double row surface-mounted straight socket strip, 2x35, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip SMD 1x11 2.54mm single row Surface mounted socket strip THT 2x15 2.54mm double row Through hole angled pin header SMD 2x01 2.54mm double row surface-mounted straight socket strip, 2x11, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC header THT 2x24 1.27mm double row surface-mounted straight pin header, 2x23, 1.27mm pitch.

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