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BackThickness; right_rib_x = width_mm - h_margin; cv_in = [h_margin, row_1, 0]; pwm_in = [input_column - h_margin/2, row_1, 0]; saw_out = [third_col, fifth_row, 0]; //left_rib_x = thickness * 1; h_wall(h=4, l=right_rib_x); // one more vertical to mount a circuit board to, dead center // pcb_holder(h=10, l=top_row-rail_clearance*2-15-thickness, th=1.15, wall_thickness=1); // lower h-rib reinforcer Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= 4675f71e05fc19d3608ee6e5061bbe79ae432fb7 c4e1c30b9b Add jlc constraints DRC; replace order number text main MK_VCO/Panels/luther_triangle_vco_quentin_v2.scad 302 lines // CV out /* [Default values] */ // Four hole.
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