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14-Lead Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing.

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