Labels Milestones
BackNo exposed pad 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Shrink Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 8-lead though-hole mounted.
- -7.566841e-002 9.961951e-001 vertex -5.263578e+000 9.614641e-001.
- Thru-hole 16 pin with exposed.
- -0.243784 0.923217 vertex 8.81743 -1.78758.