Labels Milestones
BackBody [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale.
- Main 26b0f01955 Fix for component clearance, panel thickness.
- 46mm width 19.1mm Vishay TJ7 L_Toroid.