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205-00078 vertical pitch 3.5mm size 25.2x7mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 804-311, 45Degree (cable under 45degree), 4 pins, pitch 5mm, size 30x12.5mm^2, drill diamater 1.15mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00067_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block TE 282834-8 pitch 2.54mm size 28.4x6.2mm^2 drill 1.1mm pad 2.2mm Terminal Block Phoenix PT-1,5-11-3.5-H, 11 pins, pitch 10mm, size 55x10.3mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00079 vertical pitch 3.5mm size 31.5x7.6mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 236-301, 45Degree (cable under 45degree), 8 pins, https://www.diodes.com/assets/Datasheets/ZXSBMR16PT8.pdf 8-pin SOT-383FL package, http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 32 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body [QFN] (see datasheet at http://www.cypress.com/file/138911/download and app note 93 (https://www.catagle.com/45-2/PDF_AN93.htm Bourns TBU-CA Fuse, 2.

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