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50Ohm, 4GHz, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1478035%7FB1%7Fpdf%7FEnglish%7FENG_CD_1478035_B1.pdf%7F1-1478035-0 BNC RF Interface, PCB mount (https://www.amphenolltw.com/2012download/2D%20PDF/03_M%20Series%20Sensor%20Connectors/M8S-XXPMMR-SF8001.pdf 3.5 mm, Stereo, Right Angle, Bayonet, 50Ohm, 4GHz, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1478035%7FB1%7Fpdf%7FEnglish%7FENG_CD_1478035_B1.pdf%7F1-1478035-0 BNC RF Interface, PCB mount (https://www.amphenolltw.com/2012download/2D%20PDF/03_M%20Series%20Sensor%20Connectors/M8S-XXPMMR-SF8001.pdf 3.5 mm, Stereo, Right Angle, Surface Mount, Push-Pull Type, 1.42mm Height, with Detect Switch JST ACH series connector, S26B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Maxim TDFN, 6 Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.5 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, 53398-1371 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 42819-52XX, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin with exposed pad Micrel MLF, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=80), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-10DP-2DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5140, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator TE, 3-826576-6, 36 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: AE-6410-12A example for new part number: A-41792-0013 example for new mpn: 39-30-0060, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-12A example for new mpn: 39-30-0060, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-3010, 30 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B12B-XH-AM.

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