Labels Milestones
BackDSBGA, area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x32, 2.54mm pitch, 6mm pin length, single row Through hole vertical IDC header triangle being so far out 5e32fb4fc0 Change transistor footprint to inline_wide, fix DRC ground plane Change transistor footprint to inline_wide, fix DRC ground Fireball/Fireball.kicad_pro | 8 | 1N4148 | 100V 0.15A standard switching diode, DO-35"/>