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300mil PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Stretched Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf.

• 0.956937 -0.288339 0.0336393 facet normal -7.070919e-001 -3.148546e-003.
• PORTAL.png' d8deca9307 Delete '3D Printing/Panels/BLADE BARRIER.png' 3D.
• Vertex -5.06488 4.7897 6.94018 facet normal -0.584885 0.80502.

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