Labels Milestones
Back32-Lead Frame Chip Scale Package LFCSP (5mm x 3mm) (see Linear Technology DFN_8_05-08-1719.pdf DFN, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf7032_en.pdf Inductor, TDK, MLZ2012_h1.25mm, 2.0x1.25x1.25mm.
- Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16.
- HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf Footprint for Mini-Circuits case.
- (MC) - 2x3x0.9 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf.
- Connector, B14B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Hirose.
- By 269f3bf9f9109b69cf4264b79cb1ed6f6a114782 footprint "3.5mm_jack_hole_nonpcb" (version 20221018) (generator.