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BackDFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil 3-lead though-hole mounted DIP.
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