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3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484.

• -0.464148 0.855076 vertex 4.78839 -5.45272.
• 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C or.

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