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Mils 40-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead.

• HEXDIP DirectFET L4 MOSFET.
• 4.204979e-16 -1.000000e+00 1.030057e-14 facet normal 0.24747 0.963812.
• 2x11 2.54mm double row.
• Connector, B11B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated.

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