Labels Milestones
Back1.00 SSOP14: plastic shrink small outline package; 48 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad 3x2mm Pitch 0.5mm VSSOP DCU R-PDSO-G8 Pitch0.5mm VSSOP-8 3.0 x 3.0, http://www.ti.com/lit/ds/symlink/lm75b.pdf VSSOP-8 3.0 x 3.0 VSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/xtr111.pdf#page=27), generated with kicad-footprint-generator JST XH series connector, B09B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST ZE series connector, 502382-0670 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0330, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-128-02-xxx-DV-BE-A, 28 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV-BE-LC, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 128 Pin.
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