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Go in long leg down (from the front panel and Pin 1, steel retention lug, lateral right PCB mount, retention spring, https://www.neutrik.com/en/product/ncj9fi-h Combo I series, 3 pole female XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, horizontal PCB mount, https://www.neutrik.com/en/product/nl4md-h speakON Chassis Connectors, 4 pole male XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, horizontal PCB mount, https://www.neutrik.com/en/product/nc3fav2 A Series, 4 pole female XLR receptacle, grounding: separate ground contact to mating connector shell to pin1 and front panel, horizontal PCB mount, replaces NL4MD-H, NL4MD-H-1, NL4MD-H-3, https://www.neutrik.com/en/product/nl4mdxx-h-3 speakON Chassis Connectors, 4 pole chassis connector, black D-size flange, switchable version of bornier5 simple 6pin terminal block, pitch 5.0mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40r.pdf diode bridge Single phase bridge rectifier case 28.6x28.6mm, pitch 18.0mm & 11.6mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/kbpc1500fw.pdf Diotec 32x5.6x17mm rectifier package, 7.5mm/10mm pitch, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40c3700.pdf Diotec rectifier diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.61x2.88mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Quad Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA.

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