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7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 10.95mm SOT-93 TO-218-2, Vertical, RM 2.286mm SIPAK Horizontal RM 2.54mm TO-220-4, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-7 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-9, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-4 Horizontal RM 2.54mm TO-126-3, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 0.9mm staggered type-2 TO-220-11, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-5, Horizontal, RM 2.54mm TO-220-5, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-9, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 1x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch.

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