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Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.127 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector wire 0.5sqmm double-strain-relief Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29), generated with kicad-footprint-generator ipc_noLead_generator.py GPS Module, Patch on Top, https://www.quectel.com/UploadImage/Downlad/Quectel_L80-R_Hardware_Design_V1.2.pdf QFN-24, Pitch 1.20 no EP, https://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_xm1100_product_technical_specification ublox LEA 6/7/8 ublox MAX 6/7/8 ublox MAX 6/7/8 ublox MAX 6/7/8, (https://www.u-blox.com/sites/default/files/MAX-8-M8-FW3_HardwareIntegrationManual_%28UBX-15030059%29.pdf GPS ublox MAX 6/7/8 ublox NEO 6/7/8, (https://www.u-blox.com/sites/default/files/NEO-8Q-NEO-M8-FW3_HardwareIntegrationManual_%28UBX-15029985%29_0.pdf GPS ublox NEO 6/7/8, (https://www.u-blox.com/sites/default/files/NEO-8Q-NEO-M8-FW3_HardwareIntegrationManual_%28UBX-15029985%29_0.pdf GPS ublox LEA 6/7/8, (https://www.u-blox.com/sites/default/files/LEA-M8S-M8T-FW3_HardwareIntegrationManual_%28UBX-15030060%29.pdf GPS ublox NEO 6/7/8 GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT Module BC66 M66 GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 19.9x23.6x2.65mm, https://www.quectel.com/UploadImage/Downlad/M95_Hardware_Design_V1.3.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-052, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for the grant of the attribution notices cannot be undone. Continue? Main MK_VCO/Schematics/LUTHERS_VCO.diy 8073 lines - 2 pin Molex connector 2.54 mm spacing R23, R24, R25, R27 | 4 | 1M | Resistor | | | | | C3, C4, C11 | 2 Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14, might be more robust and easier to adjust CV output range, switch between 5v and 2.5v max (or whatever is configured). Momentary-normal-off pushbutton to manually reset. - One potentiometer for internal clock rate (if onboard clock is used // 11 SPDT switches (many used as SPST - 2 x 6mm drills 3 pin Molex.

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