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Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils.

• TSSOP, 16 Pin (http://www.st.com/resource/en/datasheet/lis331hh.pdf.
• -4.80907 -0.598972 21.7653 facet normal -4.120029e-001 -9.111825e-001 0.000000e+000.

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